Sizzix Die Brush & Foam Pad for Wafer-Thin Dies



SKU: SX660513

Product Description

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

Approximate measurements:

  • die brush 1-3/4 x 5-1/2

  • foam pad 4-1/2 x 7-1/4


  • Weight: 0.25 lb
  • Width: 2.25 in
  • Depth: 5.75 in
  • Height: 9.5 in

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